華中科技大學(xué)機(jī)械科學(xué)與工程學(xué)院始建于1952年，是華中科技大學(xué)規(guī)模最大、實(shí)力最雄厚的學(xué)院之一，擁有中國(guó)科學(xué)院/工程院院士8人，機(jī)械工程一級(jí)學(xué)科在全國(guó)學(xué)科評(píng)估中連續(xù)獲評(píng)A+，智能制造裝備與技術(shù)全國(guó)重點(diǎn)實(shí)驗(yàn)室被連續(xù)評(píng)估為優(yōu)秀類(lèi)國(guó)家重點(diǎn)實(shí)驗(yàn)室。依托華中科技大學(xué)機(jī)械科學(xué)與工程學(xué)院全國(guó)重點(diǎn)實(shí)驗(yàn)室和相關(guān)的科研平臺(tái)劉長(zhǎng)清教授課題組擬向國(guó)內(nèi)外公開(kāi)招聘博士后科研人員2-3名。

一、課題組負(fù)責(zé)人介紹

現(xiàn)任華中科技大學(xué)機(jī)械科學(xué)與工程學(xué)院教授、博士生導(dǎo)師劉長(zhǎng)清長(zhǎng)期從事先進(jìn)電子材料和制造技術(shù)的創(chuàng)新研究，包括半導(dǎo)體芯片器件異構(gòu)集成，互連，封裝及可靠性、互連界面特性及鍵合機(jī)理、電化學(xué)沉積互連凸點(diǎn)、功率電子及寬帶半導(dǎo)體集成與封裝、生物電子和智能可穿戴電子等相關(guān)的研究工作。迄今為止在相關(guān)領(lǐng)域國(guó)際材料及先進(jìn)制造期刊及國(guó)際會(huì)議發(fā)表了300多篇相關(guān)學(xué)術(shù)論文。主持參與了若干科研項(xiàng)目并與世界各地包括帝國(guó)理工、倫敦大學(xué)國(guó)王學(xué)院、諾丁漢大學(xué)、曼徹斯特大學(xué)、新加坡南洋理工大學(xué)、香港城市大學(xué)等約30所院校、研究機(jī)構(gòu)合作交流，指導(dǎo)了近40名博士生。他是美國(guó)電器電子工程師協(xié)會(huì)（IEEE）資深會(huì)員、曾任IEEE協(xié)會(huì)電子封裝(EPS) 領(lǐng)域旗艦電子元件和技術(shù)國(guó)際會(huì)議（ECTC）的電子互連委員會(huì)主席，先后受聘于新加坡南洋理工大學(xué)、和香港城市大學(xué)(由英國(guó)皇家協(xié)會(huì)資助和任命)等國(guó)際知名大學(xué)的客座教授。

二、研究方向與內(nèi)容

半導(dǎo)體元器件異構(gòu)集成及制造技術(shù)：電子封裝材料及制備；銅互連及其應(yīng)用；電子互連界面特性、力學(xué)行為與可靠性； “綠色”可持續(xù)電子制造。

嚴(yán)酷服役條件下的電子互連材料及制造技術(shù)：高溫互連材料，制造及應(yīng)用；低溫電子互連材料和制備；嚴(yán)酷環(huán)境下熱-電-機(jī)械耦合可靠性分析及失效機(jī)理。

寬帶半導(dǎo)體集成互連和熱管理優(yōu)化：功率電子寬帶半導(dǎo)體先進(jìn)互連材料與制程優(yōu)化 (die-attach, substrate-attach)；高溫?cái)U(kuò)散障、熱界面材料制備及系統(tǒng)熱管理優(yōu)化。

生物及智能可穿戴電子異質(zhì)集成技術(shù)：生物電子界面材料和制備；打印/柔性/有機(jī)電子相關(guān)材料及制造技術(shù)；電-生物-多材料多功能系統(tǒng)集成； 3D增材構(gòu)建多功能復(fù)合仿生組織。

三、應(yīng)聘條件

1.申請(qǐng)者年齡不超過(guò)35周歲，獲得博士學(xué)位不超過(guò)3年，具有嚴(yán)謹(jǐn)?shù)目蒲袘B(tài)度和良好的團(tuán)隊(duì)協(xié)作精神，符合華中科技大學(xué)博士后招聘條件http://postdoctor.hust.edu.cn/info/1007/2928.htm。

2.應(yīng)聘者應(yīng)具有與以上相關(guān)研究方向?qū)W科背景，包括先進(jìn)電子材料與制造技術(shù)，集成電路及電子器件互連與封裝，機(jī)械電子技術(shù)，電子信息工程等多學(xué)科交叉領(lǐng)域。具有較強(qiáng)的理論基礎(chǔ)、實(shí)踐能力、獨(dú)立的科研能力，以及良好的團(tuán)隊(duì)合作精神。

3.具有較強(qiáng)的英語(yǔ)交流與寫(xiě)作能力，并能夠積極參與實(shí)驗(yàn)室建設(shè)和研究生培養(yǎng)工作。

四、崗位待遇

1.博士后聘用期限為2年起，年薪40-60萬(wàn)，并享受各類(lèi)成果獎(jiǎng)勵(lì)。

2.博士后在聘期內(nèi)，參照學(xué)校在編在崗職工，享受子女入學(xué)入托、社會(huì)醫(yī)療保險(xiǎn)以及其他社會(huì)保險(xiǎn)等福利待遇；可申請(qǐng)入住博士后公寓；表現(xiàn)優(yōu)秀者可競(jìng)聘教師崗位。

3.提供充足的科研經(jīng)費(fèi)和完善的實(shí)驗(yàn)條件，提供國(guó)際會(huì)議等交流機(jī)會(huì)，協(xié)助申報(bào)科研項(xiàng)目。

五、應(yīng)聘材料及申請(qǐng)流程

1.個(gè)人中英文簡(jiǎn)歷（包括個(gè)人基本信息、學(xué)習(xí)工作經(jīng)歷、科研項(xiàng)目參與情況、博士論文研究?jī)?nèi)容、論文發(fā)表情況等）

2.證明材料（博士學(xué)位證書(shū)掃描件或教育部學(xué)籍在線驗(yàn)證報(bào)告、學(xué)位論文首頁(yè)以及不超過(guò)5篇代表作）

3.兩封以上本學(xué)科領(lǐng)域高級(jí)職稱(chēng)專(zhuān)家推薦信。

4.博士后工作期間研究計(jì)劃和預(yù)期目標(biāo)。  

5.應(yīng)聘者應(yīng)將上述材料按順序合并成1個(gè)PDF文件，發(fā)送到chenjia617@hust.edu.cn，郵件標(biāo)題請(qǐng)注明：應(yīng)聘博士后+本人姓名。

6.截止時(shí)間: 長(zhǎng)年有效。

Postdoctoral Research Positions

Advanced Electronics Materials and Manufacturing

School of Mechanical Science and Engineering

Huazhong University of Science and Technology

Founded in 1952, the School of Mechanical Science and Engineering is one of the largest and strongest colleges in Huazhong University of Science and Technology(HUST), with 8 academicians of the Chinese Academy of Sciences/Academy of Engineering. Based on the National Key Laboratory at the School of Mechanical Science and Engineering of HUST and related scientific research platforms, Professor Liu Changqing's research group seeks to recruit 2-3 postdoctoral researchers in the areas of advanced electronics materials and manufacturing technology.

1. Professor Liu Changqing

   Prof. Liu is a professor and doctoral supervisor at the School of Mechanical Science and Engineering at HUST in China, and an emeritus professor of Loughborough University in the United Kingdom. He has been extensively engaged in innovative research on advanced electronic materials and manufacturing technologies, including IC device heterogeneous integration, interconnection, packaging, interfacial characteristics and bonding mechanisms and reliability analysis; power electronics and Wide-band Gap (WBG) semiconductor integration and packaging; bioelectronics and intelligent wearable and implantable electronics. He has published more than 300 academic articles in international journals and conferences, and collaborated with over 30 universities and research institutions around the world, including Imperial College London, King's College London, University of Nottingham, University of Manchester, Nanyang Technological University of Singapore, City University of Hong Kong, etc., and his research work have attracted an extensive attention and recognition from his international peers, relevant organisations and industries.

Liu Changqing-School of Mechanical Science and Engineering (hust.edu.cn)

1. Description of Research Areas

Heterogeneous integration and packaging of semiconductor devices: electronic packaging materials and preparation; copper interconnection and its application; interface characteristics, mechanical behavior and reliability of electronic interconnection; "green" sustainable electronics manufacturing.

Electronic interconnect materials and manufacturing in harsh environments: high-temperature interconnect materials, manufacturing and application; low-temperature electronic interconnect materials and preparation; reliability analysis and failure mechanism in thermal-electric-mechanical coupled harsh environments.

Wide-band Gap (WBG) semiconductor integration、interconnect and thermal management optimization: Advanced Interconnect Materials (AIMs) and processes for die-attach, substrate-attach and optimization in power electronics; high-temperature diffusion barriers, thermal interface material fabrication; and system thermal management optimization.

Heterogeneous integration for bioelectronics and intelligent wearable electronics: bioelectronic interface materials and fabrication; printing/flexible/organic electronics related materials and manufacturing technologies; bio-electronic multi-material multifunctional system integration; 3D additive construction of multifunctional composite bionic tissues.

1. Requirements and Qualifications of Applicants

2. Applicants should be ideally under the age of 35, have obtained a doctorate degree for no more than 3 years, bearing a rigorous scientific research attitude and good teamwork spirit, see the further details via http://postdoctor.hust.edu.cn/info/1007/2928.htm

3. Candidates should have a suitable PhD degree in the related science and engineering subjects such as physics and chemistry, materials, and some research experience in electronic materials and manufacturing, Integrated Circuit and device integration and packaging, with a strong theoretical foundation, relevant practical skills, independent scientific research ability, and good team spirit.

4. Competent English communication and writing skills, being able to actively participate in the activities for set-up of the laboratory and supply relevant training to graduate students.

1. Terms and Conditions

   1. The term of employment of postdoctoral fellows is 2 years, with an annual salary up to 400,000 Chinese Yuan.

   2. During the employment period, postdoctoral fellows can enjoy welfare benefits such as children's enrollment in nurseries, social medical insurance and other social insurance, and can apply for a place in postdoctoral apartments.

   3. The HUS will commit to the strongest supports to the successful candidates by providing sufficient research funds, an excellent research environment and development platform, offering opportunities of attending international conferences and other international research exchange, and helping for the research applications, and those with outstanding performance can be recommended for consideration of an offer of teaching position.

       

2. Procedures of Application

   1. Curriculum vitae in Chinese and English including basic personal information, academic work experience, participation in scientific research projects, research content of doctoral dissertation, publication of dissertation, etc.

   2. Supporting materials including scanned copy of doctoral degree certificate or online verification report of student status of the Ministry of Education, the first page of the dissertation and no more than 5 representative works).

   3. Two or more letters of recommendation from experts with senior professional titles in the relevant subject field.

   4. Research plan and expected goals during postdoctoral work.  

   5. Applicants should put together the above materials into single PDF file and send via email: chenjia617@hust.edu.cn with the subject indicated as “Postdoctoral application + Applicant’s name”.

   6. The dates and details of interview for shortlisted candidates will be arranged and notified separately.

   7. Deadline: Positions are open to outstanding candidates all the year around.

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